3D Model Datasheet
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Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±30%)
DCR (mΩ) 3 SRF (MHz) 4 Isat (A) 5 Irms (A) 6
typ max min typ 10% drop 20% drop 30% drop 20°C rise 40°C rise
ML612PNB102NLZ 1.0 6.3 7.0 80.0 115 31.8 35.0 36.8 7.1 10.1
  1. When ordering, please specify screening code: e.g. ML612PNB105KLZ.
  2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP 4263B LCR meter or equivalent.
  3. DCR measured on a micro-ohmmeter and a Coilcraft CCF858 test fixture.
  4. SRF measured using an Agilent/HP 8753D network analyzer.
  5. Typical DC current at which the inductance drops the specified amount from its value without current.
  6. Typical current that causes the specified temperature rise from 25°C ambient.


  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Group A screening per Coilcraft CP-SA-10001
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
  • Screening performed to the document’s latest revision.
  • Custom testing also available.
  • Country of origin restrictions available; prefix option G.
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55C to +155°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Current

Typical L vs Frequency

Physical characteristics


General specification

Core Material:
3.8 g – 4.6 g
500/13″ reel; Plastic tape: 24 mm wide, 0.4 mm thick, 16 mm pocket spacing, 8.1 mm pocket depth.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.