3D Model Datasheet

AR312FRA Series

Common Mode Chokes for Critical Applications

AR312FRA Series designed for high-speed USB 3.0, HDMI, SATA, IEEE1394 and LVDS applications.
  • Designed for high-speed USB 3.0, HDMI, SATA, IEEE1394 and LVDS applications.
  • Supports data rates up to 4.8 Gbit/s.
  • Miniature EIA 0603 footprint; only 1.07 mm tall
  • Most values provide >15 dB common mode attenuation and >100 ohms impedance.
  • Passes NASA low outgassing specifications

Looking for the commercial version of this part? See Coilcraft 0603USB Series
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Specifications

Part number 1 Lines Common mode
peak impedance (kΩ)
Cutoff
frequency (GHz) 2
Common mode
attenuation typ (dB)
Inductance
min (nH) 3
Irms (mA) DCR max (Ω) 4 Isolation
Voltage (Vrms) 5
100 MHz 500 MHz 1 GHz
AR312FRA251MPZ 2 0.10 @ 3.0 GHz 3.8 3.27 5.13 7.07 18 500 0.077 250
AR312FRA601MPZ 2 0.18 @ 3.0 GHz 3.4 5.76 9.46 12.6 37 500 0.109 250
AR312FRA951MPZ 2 0.30 @ 2.6 GHz 2.8 8.89 12.64 16.6 63 500 0.142 250
AR312FRA142MPZ 2 0.42 @ 1.9 GHz 1.9 10.88 15.89 19.3 98 500 0.174 250
AR312FRA222MPZ 2 0.66 @ 1.8 GHz 0.96 12.45 19.85 23.4 150 500 0.209 250
Notes
  1. When ordering, please specify termination and testing codes: e.g. AR312FRA222MPZ.
  2. Frequency at which the differential mode attenuation equals −3 dB.
  3. Inductance measured at 100 MHz using an Agilent/HP 4286A impedance analyzer and a Coilcraft SMD-A fixture.
  4. DCR is specified per winding.
  5. Winding to winding isolation (hipot) tested for one minute.

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silver-palladium-glass frit.
  • C  = Tin-lead (63/37) over gold over nickel over silver-palladium-glass frit
  • A = Gold over nickel over silver-palladium-glass frit
  • R = Tin over nickel over silver-palladium-glass frit. Not suitable for applications or screening with pure tin restrictions.

Testing:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • 1 = EEE-INST-002 (Family 1) Level 1
  • 2 = EEE-INST-002 (Family 1) Level 2
  • 3 = EEE-INST-002 (Family 1) Level 3
  • 4 = MIL-STD-981 (Family 11) Class B
  • 5 = MIL-STD-981 (Family 11) Class S
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
Environmental
Ambient temperature range:
–40°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +125°C.
Tape and reel packaging: –40°C to +80°C.
Maximum part temperature:
+125°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical Differential Mode Attenuation

Typical Common Mode Attenuation

Typical Impedance vs Frequency

Physical characteristics

ar312frad.gif

dims_inches_mm.gif

General specification

Core Material:
Ferrite
Weight:
4.5 – 6.4 mg
Packaging:
2000 per 7″reel; Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.14 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.