Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance min (mH) 2 |
DCR max (Ω) |
Volt-time product (V-µs) 3 |
Frequency (kHz) | Sensed current max (A) 4 |
Terminating resistance RT (Ω) 5 |
Isolation Voltage (Vrms) |
|
|---|---|---|---|---|---|---|---|---|
| pri | sec | |||||||
| ST630TCB1200LZ | 7.2 | 0.00084 | 4.0 | 791 | 0.6 — 1000 | 40.0 | 5.0 | 4000 |
Notes
- When ordering, please specify termination and screening codes: e.g. ST630TCB1300LZ.
- Inductance measured between secondary pins at 10 kHz, 0.1 Vrms, 0 Adc.
- Volt-time product is for the secondary, between pin 3 and 1.
- Primary current of 40 A causes less than 40°C temperature rise from 25°C ambient. Higher current causes a greater temperature rise (see Temperature Rise vs Current curve).
- Terminating resistance (RT) value is based on 1 Volt output with 40 Amps flowing through the primary. Varying terminating resistance increases or decreases output Voltage/Ampere according to the following equation: RT = Vout × Nsec/Iin.
Termination:
- L = Tin-silver-copper over tin over copper over steel (pins 1 – 3); Tin-silver-copper over tin over nickel over copper (pins 4 – 5)
- S = Tin-lead over tin over copper over steel (pins 1 – 3); Tin-lead over tin over nickel over copper (pins 4 – 5)
Screening:
- Z = Unscreened
- H = Group A screening per Coilcraft CP-SA-10001
- Screening performed to the document’s latest revision.
- Custom testing also available.
- Country of origin restrictions available; prefix option G.
Environmental
Ambient temperature range:
–40°C to +125°C.
Storage temperature range:
Component: –55°C to +165°C.
Tray packaging: –40°C to +80°C.
Tray packaging: –40°C to +80°C.
Maximum part temperature:
+165°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Temperature Rise vs Current
Schematics
General specification
Core Material:
Ferrite
Weight:
7.0 – 8.5 g
Packaging:
100 per tray.
Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.