3D Model
Datasheet
AR413RAM Series
High-Reliability Chip Inductors
AR413RAM Series features ferrite construction providing the lowest DCR and highest current rating of our 1008 size inductors. This robust version of Coilcraft’s standard 1008AF series features high temperature materials that allow operation in ambient temperatures up to 140°C. The leach-resistant base metalization with tin-lead (Sn-Pb) terminations ensures the best possible board adhesion.
- Ferrite construction provides lowest DCR and highest current rating of our 1008 size inductors.
- Available in 14 inductance values from 0.9 to 10 µH, all at 10% tolerance.
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±10%) |
Q min
@ 2.5 MHz 3 |
SRF min (MHz) 4 | Isat (A) 5 | DCR max (Ω) 6 | Imax (A) |
|---|---|---|---|---|---|---|
| AR413RAM901KPZ | 0.90 | 12 | 415 | 1.4 | 0.120 | 0.76 |
| AR413RAM112KPZ | 1.1 | 11 | 376 | 1.3 | 0.130 | 0.72 |
| AR413RAM132KPZ | 1.3 | 8 | 198 | 1.2 | 0.145 | 0.64 |
| AR413RAM152KPZ | 1.5 | 11 | 135 | 1.1 | 0.155 | 0.62 |
| AR413RAM192KPZ | 1.9 | 14 | 126 | 1.0 | 0.180 | 0.60 |
| AR413RAM222KPZ | 2.2 | 12 | 106 | 0.95 | 0.186 | 0.58 |
| AR413RAM272KPZ | 2.7 | 11 | 70.0 | 0.80 | 0.210 | 0.57 |
| AR413RAM332KPZ | 3.3 | 11 | 59.0 | 0.75 | 0.240 | 0.53 |
| AR413RAM392KPZ | 3.9 | 12 | 55.0 | 0.70 | 0.260 | 0.50 |
| AR413RAM472KPZ | 4.7 | 13 | 48.0 | 0.70 | 0.450 | 0.36 |
| AR413RAM582KPZ | 5.8 | 12 | 37.0 | 0.55 | 0.320 | 0.45 |
| AR413RAM682KPZ | 6.8 | 12 | 33.0 | 0.50 | 0.330 | 0.42 |
| AR413RAM822KPZ | 8.2 | 13 | 29.0 | 0.50 | 0.340 | 0.42 |
| AR413RAM103KPZ | 10 | 14 | 22.0 | 0.45 | 0.460 | 0.36 |
Notes
- When ordering, specify termination and screening code: AR413RAM103KPZ
- Inductance measured at 2.5 MHz using Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
- Q measured at 2.5 MHz using an Agilent/HP 4291A with an Agilent/HP 16197 test fixture or equivalents.
- SRF measured using an Agilent/HP 8753ES network analyzer or equivalent with a Coilcraft CCF1502 test fixture.
- DC current at which the inductance drops 10% (typ.) from its value without current.
- DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a Coilcraft CCF859 test fixture.
Termination:
- P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit.
- C = Tin-lead (63/37) over gold over nickel over moly-mag
- S = Tin-lead (63/37) over leach-resistant silver-platinum-glass frit
- A = Gold over nickel over moly-mag
- L = Silver-palladium-platinum-glass frit
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- 1 = EEE-INST-002 (Family 3) Level 1
- 2 = EEE-INST-002 (Family 3) Level 2
- 3 = EEE-INST-002 (Family 3) Level 3
- 4 = MIL-STD-981 (Family 50) Class B
- 5 = MIL-STD-981 (Family 50) Class S
- F = ESCC3201 (F4 operational life performed at 90°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–40°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Current
L vs Frequency
Q vs Frequency
Physical characteristics
Dimensions are in inches⁄mm
Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0.064 mm to the width and 0.006 in / 0.15 mm to length and height.
General specification
Core Material:
Ferrite
Weight:
27 – 35 mg
Packaging:
Enhanced crush-resistant packaging 2000 per 7″ reel
Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 2.0 mm pocket depth
Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 2.0 mm pocket depth
Temperature coefficient of inductance:
+100 to +350 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.