Datasheet 3D Model

AE336RBA Series

Molded Chip Inductors

The AE336RBA Series is not recommended for new designs, but existing customers will continue to be supported. As an alternative, we recommend AR336RAA Series which is a drop-in replacement with improved electrical performance due to lower DCR.

AE336RBA Series features exceptional Q values, even at high frequencies.

Passes NASA low outgassing (Outgassing meets ASTM E595).
Resistant to harsh chemical washes; excellent board adhesion.
Fits standard 0805 footprint.
Gold over nickel terminations. (Tin-lead (63/37) and tin-silver-copper are also available.)

Specifications

Electrical specifications at 25°C.

Part number 1	Inductance (nH) 2 (Tolerance: ± 5%)	Q min 3	SRF min (MHz) 4	DCR max (Ω) 5	Imax (mA) 6
Part number 1	Inductance (nH) 2 (Tolerance: ± 5%)	Q min 3	SRF min (MHz) 4	DCR max (Ω) 5	Imax (mA) 6
AE336RBA3N0JAZ	3.0 @ 250 MHz	71 @ 1000 MHz	5000	0.105	800
AE336RBA050JAZ	5.6 @ 250 MHz	63 @ 1000 MHz	4420	0.100	600
AE336RBA110JAZ	11 @ 250 MHz	54 @ 500 MHz	2975	0.144	600
AE336RBA330JAZ	33 @ 250 MHz	57 @ 500 MHz	1530	0.332	500
AE336RBA121JAZ	120 @ 150 MHz	51 @ 250 MHz	893	0.575	380
AE336RBA151JAZ	150 @ 100 MHz	32 @ 100 MHz	822	0.628	340
AE336RBA231JAZ	230 @ 100 MHz	32 @ 100 MHz	613	1.040	270
AE336RBA321JAZ	320 @ 100 MHz	33 @ 100 MHz	519	1.580	230
AE336RBA471JAZ	470 @ 50 MHz	30 @ 100 MHz	315	1.470	230
AE336RBA681JAZ	680 @ 25 MHz	23 @ 50 MHz	242	2.240	190
AE336RBA102JAZ	1000 @ 25 MHz	22 @ 25 MHz	220	3.000	150
AE336RBA222JAZ	2200 @ 25 MHz	18 @ 25 MHz	85	4.800	140
AE336RBA332JAZ	3300 @ 25 MHz	22 @ 25 MHz	110	8.070	80

Notes

When ordering, please specify termination and screening codes: e.g. AE336RBA332JAZ.
Inductance measured using a Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer with Coilcraft-provided correlation pieces.
Q measured using an Agilent/HP 4291A with an Agilent/HP 16193 test fixture.
SRF measured using an Agilent/HP 8720D network analyzer and a Coilcraft SMD -D test fixture.
DCR measured on a Cambridge Technology micro-ohmmeter and a Coilcraft CCF858 test fixture.
Current that causes a 15°C temperature rise from 25°C ambient.

Termination:

A = Gold over nickel over moly-mag
C = Tin-lead (63/37) over gold over nickel over moly-mag.
F = Tin-silver-copper (95.5/4/0.5) over gold over nickel over moly-mag.

Screening:

Z = Unscreened
H = Coilcraft CP-SA-10001 Group A
1 = EEE-INST-002 (Family 3) Level 1
2 = EEE-INST-002 (Family 3) Level 2
3 = EEE-INST-002 (Family 3) Level 3
4 = MIL-STD-981 (Family 50) Class B
5 = MIL-STD-981 (Family 50) Class S
F = ESCC3201 (F4 operational life performed at 90°C)
Screening performed to the document’s latest revision.
Lot qualification (Group B) available.
Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
Country of origin restrictions available; prefix option G or F.

Environmental

Ambient temperature range:

–55°C to +125°C with Irms current, +125°C to +155°C with derated current.

Storage temperature range:

Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

See FIT/MTBF Calculations

Performance curves

Typical L vs Frequency

Typical Q vs Frequency

Physical characteristics

General specification

Core Material:

Ceramic

Weight:

18.0 – 23.0 mg

Packaging:

2000/7′′ reel; Plastic tape: 12 mm wide, 0.254 mm thick, 4 mm pocket spacing, 1.98 mm pocket depth.

Temperature coefficient of inductance:

+100 to +250 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity).

Resistance to soldering heat:

Minimum five 40 second reflows at +260°C, parts cooled to room temperature between cycles.

Refer to Soldering Coilcraft Components before soldering.

PCB Washing:

Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.