AE563PKA474

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Specifications

Electrical specifications at 25°C.

Part number 1	Inductance (µH) 2 (Tolerance: ±20%)	DCR (mΩ)		SRF (MHz) 3		Isat (mA) 4			Irms (mA) 5
Part number 1	Inductance (µH) 2 (Tolerance: ±20%)	typ	max	min	typ	10% drop	20% drop	30% drop	20°C rise	40°C rise
AE563PKA474MSZ	470	1360	1600	3.6	4.3	350	440	480	340	470

Notes

hen ordering, specify screening code: e.g. AE563PKA153MSZ.
Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP 4263B LCR meter or equivalent.
SRF measured using Agilent/HP 8753D network analyzer or equivalent.
Typical DC current at which the inductance drops 10% (typ) from its value without current.
Typical Current that causes a 40°C temperature rise from 25°C ambient.

Z = Unscreened
Y = Unscreened (SLDC Option A)
W = Unscreened (SLDC Option B)
H = Coilcraft CP-SA-10001 Group A
G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
1/2/3 = EEE-INST-002 (Family 1) Level 1/2/3
4/5 = MIL-STD-981 (Family 04) Class B=4, Class S=5
F = ESCC3201 (F4 operational life performed at 105°C)
Screening performed to the document’s latest revision.
Lot qualification (Group B) available.
Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
Country of origin restrictions available; prefix options G or F.

Environmental

Ambient temperature range:

–55°C to +105°C with Irms current.

Storage temperature range:

Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.

Maximum part temperature:

+155°C (ambient + temp rise).

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Core Material:

Ferrite

Weight:

0.95– 1.25 g

Packaging:

750 per 13″ reel Plastic tape: 24 mm wide, 0.35 mm thick, 12 mm pocket spacing, 6.4 mm pocket depth.

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity).

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.

Refer to Soldering Coilcraft Components before soldering.