Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±20%) |
DCR (mΩ) 3 | SRF (MHz) 4 | Isat (A) 5 | Irms (A) 6 | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| typ | max | min | typ | 10% drop | 20% drop | 30% drop | 20°C rise | 40°C rise | ||
| MS322PZA102MSZ | 1.0 | 153 | 169 | 136 | 170 | 0.71 | 1.0 | 1.2 | 0.91 | 1.2 |
Notes
- When ordering, please specify screening code: e.g. MS322PZA104MSZ.
- Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
- DCR measured on a micro-ohmmeter.
- SRF measured using Agilent/HP 4395A or equivalent.
- DC current at 25°C that causes the specified inductance drop from its value without current.
- Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Group A screening per Coilcraft CP-SA-10001
- G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical L vs Current
Physical characteristics
Note: Earlier production parts may not be marked with a dot.
Tape and Reel specification
General specification
Core Material:
Composite
Weight:
9 – 13 mg
Packaging:
2000/7′′ reel Plastic tape: 8 mm wide, 0.28 mm thick, 4 mm pocket spacing, 0.76 mm pocket depth
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.