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Close up of AE338PZA
3D Model Datasheet

AE338PZA Series

Outgassing Compliant Power Inductors

AE338PZA Series offers exceptionally low DCR – 12.0 mOhm.
  • High temperature materials allow operation in ambient temperatures up to 155°C.
  • Passes NASA low outgassing specifications.
  • Very low DCR and excellent current handling.
  • Tin-lead (Sn-Pb) termination for the best possible board adhesion.
  • Passes vibration testing to 30 G and shock testing to 500 G.

Looking for the commercial version of this part? See Coilcraft XFL2010 Series
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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2
(Tolerance: ±20%) 		DCR (Ω) 3 SRF typ (MHz) 4 Isat (A) 5 Irms (A) 6
typ max 10% drop 20% drop 30% drop 20°C rise 40°C rise
AE338PZA400MP_ 0.040 0.012 0.016 2200 5.5 7.5 8.6 3.4 4.8
AE338PZA121MP_ 0.12 0.017 0.022 730 3.0 4.3 4.9 2.7 3.7
AE338PZA221MP_ 0.22 0.020 0.025 400 2.1 3.2 3.8 2.3 3.1
AE338PZA381MP_ 0.38 0.028 0.033 280 1.7 2.5 3.1 2.1 2.9
AE338PZA601MP_ 0.60 0.047 0.054 200 1.3 2.0 2.3 1.8 2.4
AE338PZA821MP_ 0.82 0.052 0.061 160 1.1 1.5 2.0 1.6 2.2
AE338PZA102MP_ 1.0 0.072 0.083 130 0.95 1.4 1.7 1.3 1.8
AE338PZA152MP_ 1.5 0.100 0.115 110 0.75 1.2 1.5 1.2 1.6
AE338PZA222MP_ 2.2 0.136 0.156 90 0.70 1.1 1.3 1.0 1.4
AE338PZA332MP_ 3.3 0.185 0.213 65 0.60 0.85 1.0 0.88 1.2
AE338PZA472MP_ 4.7 0.278 0.320 60 0.42 0.64 0.78 0.68 0.91
AE338PZA682MP_ 6.8 0.352 0.405 50 0.39 0.61 0.72 0.58 0.79
AE338PZA822MP_ 8.2 0.445 0.511 40 0.38 0.55 0.62 0.56 0.76
AE338PZA103MP_ 10 0.517 0.595 36 0.29 0.45 0.56 0.51 0.67
Notes
  1. When ordering, please specify termination and screening code: AE338PZA103MPZ.
  2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
  3. DCR measured on a micro-ohmmeter.
  4. SRF measured using an Agilent/HP 4395A or equivalent.
  5. DC current at 25°C that causes the specified inductance drop from its value without current.
  6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.

    Note:
    Irms testing was performed on a 0.060′′ thick pcb with 4 oz. copper traces optimized to minimize additional temperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.

Termination:

  • P = Tin-lead (63/37) over tin over nickel over silver-platinum 
  • Q = Tin-silver-copper (96.5/3/0.5) over tin over nickel over silver-platinum.

Screening:

  • Z = Unscreened
  • H  = Coilcraft CP-SA-10001 Group A
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
  • 1  = EEE-INST-002 (Family 1) Level 1
  • 2 = EEE-INST-002 (Family 1) Level 2
  • 3 = EEE-INST-002 (Family 1) Level 3
  • 4 = MIL-STD-981 (Family 04) Class B
  • 5 = MIL-STD-981 (Family 04) Class S
  • F = ESCC3201 (F4 operational life performed at 105°C)
    • Screening performed to the document’s latest revision.
    • Lot qualification (Group B) available.
    • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
    • Country of origin restrictions available; prefix options G.
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
See FIT/MTBF Calculations

Performance curves

L vs Current

L vs Current

L vs Frequency

L vs Frequency

Physical characteristics

ae338pzad.gif
dims_inches_mm.gif

General specification

Core Material:
Composite
Weight:
22 mg
Packaging:
1000/7″ reel Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.19 mm pocket depth.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.