Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 | Inductance (nH) 2 | Tolerance (%) | DCR (mΩ) 3 | SRF typ (MHz) 4 | Isat (A) 5 | Irms (A) 6 | ||
|---|---|---|---|---|---|---|---|---|
| typ | max | 20°C rise | 40°C rise | |||||
| ST591PYA631_LZ | 630 | 20,30 | 1.50 | 1.70 | 50 | 74 | 21.0 | 28.5 |
Notes
- When ordering, please specify tolerance and screening codes: ST591PYA302NLZ.
- Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
- DCR measured on a micro-ohmmeter.
- SRF measured using an Agilent/HP 4395A or equivalent.
- DC current at which the inductance drops 30% (typ) from its value without current.
- Current that causes the specified temperature rise from 25°C ambient.
Note:
Irms testing was performed on a 0.060" thick pcb with 4 oz. copper traces optimized to minimize additional temperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.
Tolerance:
- N = 30%
- M = 20%
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Coilcraft CP-SA-10001 Group A
- G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
- Screening performed to the document’s latest revision.
- Custom testing also available.
Environmental
Ambient temperature range:
–40°C to +125°C with (40°C rise) Irms current.
Storage temperature range:
Component: –55°C to +165°C.
Tape and reel packaging: –40°C to +80°C.
Tape and reel packaging: –40°C to +80°C.
Maximum part temperature:
+165°C (ambient + temp rise). Derating.
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
L vs Current
General specification
Core Material:
Composite
Weight:
4.5 – 4.9 g
Packaging:
400/13″ reel Plastic tape: 24 mm wide, 0.3 mm thick, 20 mm pocket spacing, 5.2 mm pocket depth.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.