Datasheet
3D Model
MS611PYA Series
High Reliability Power Inductors
MS611PYA Series offers high current and very low DCR.
- High temperature materials allow operation in ambient temperatures up to 155°C.
- Tin-lead (Sn-Pb) termination for the best possible board adhesion.
- Soft saturation makes them ideal for VRM/VRD applications.
- Tin-lead (63/37) over copper terminations.
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±20%) |
DCR (mΩ) 3 | SRF (MHz) 4 | Isat (A) 5 | Irms (A) 6 | |||
|---|---|---|---|---|---|---|---|---|
| typ | max | min | typ | 20°C rise | 40°C rise | |||
| MS611PYA221MSZ | 0.22 | 0.45 | 0.50 | 92 | 115 | 98.8 | 30.8 | 41.6 |
| MS611PYA451MSZ | 0.45 | 0.65 | 0.72 | 53 | 66 | 70.5 | 30.0 | 39.8 |
| MS611PYA681MSZ | 0.68 | 0.87 | 0.96 | 42 | 53 | 62.0 | 28.5 | 37.5 |
| MS611PYA102MSZ | 1.00 | 1.00 | 1.10 | 34 | 42 | 55.0 | 24.0 | 32.6 |
| MS611PYA152MSZ | 1.50 | 1.60 | 1.76 | 26 | 33 | 36.6 | 23.3 | 30.4 |
| MS611PYA222MSZ | 2.20 | 2.55 | 2.80 | 18 | 22 | 34.0 | 18.4 | 24.0 |
| MS611PYA332MSZ | 3.30 | 3.70 | 4.10 | 17 | 21 | 27.4 | 13.7 | 18.8 |
| MS611PYA472MSZ | 4.70 | 5.20 | 5.70 | 15 | 19 | 25.4 | 13.1 | 18.0 |
| MS611PYA562MSZ | 5.60 | 6.30 | 6.93 | 13 | 16 | 23.6 | 11.8 | 15.9 |
| MS611PYA682MSZ | 6.80 | 8.10 | 8.90 | 11 | 14 | 21.8 | 10.5 | 13.9 |
| MS611PYA822MSZ | 8.20 | 11.70 | 12.90 | 9 | 12 | 18.3 | 9.7 | 12.8 |
| MS611PYA103MSZ | 10.00 | 13.40 | 14.75 | 8 | 11 | 17.5 | 8.6 | 11.6 |
| MS611PYA153MSZ | 15.00 | 16.90 | 18.60 | 7 | 9 | 15.5 | 7.4 | 10.4 |
Notes
- When ordering, please specify screening code: e.g. MS611PYA153MSZ.
- Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
- DCR measured on a micro-ohmmeter.
- SRF measured using an Agilent/HP 4395A or equivalent.
- DC current at 25°C that causes an inductance drop of 30% (typ) from its value without current.
- Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Note:
Irms testing was performed on a 0.060” inch thick pcb with 4 oz copper traces optimized to minimize additional termperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Group A screening per Coilcraft CP-SA-10001
- G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical L vs Current
General specification
Core Material:
Composite
Weight:
5.7 – 6.3 g
Packaging:
300/13″ reel Plastic tape: 24 mm wide, 0.4 mm thick, 16 mm pocket spacing, 10.21 mm pocket depth.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.