ML483PYA112

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Specifications

Electrical specifications at 25°C.

Part number 1	Inductance (µH) 2 (Tolerance: ±20%)	DCR (mΩ) 3		SRF (MHz) 4		Isat (A) 5	Irms (A) 6
Part number 1	Inductance (µH) 2 (Tolerance: ±20%)	typ	max	min	typ	Isat (A) 5	20°C rise	40°C rise
ML483PYA112MLZ	1.1	12.60	13.10	40	50	17.1	7.5	9.0

Notes

When ordering, please specify screening code: e.g. ML483PYA112MLZ.
Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
DCR measured on a micro-ohmmeter.
SRF measured using an Agilent/HP 4395A or equivalent.
DC current at 25°C that causes a 30% (typ) inductance drop from its value without current.
Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.

Note:
Irms testing was performed on a 0.060′′ thick pcb with 4 oz. copper traces optimized to minimize additional temperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.

All screening performed to the document’s latest revision.

Environmental

Ambient temperature range:

–55°C to +105°C with Irms current.

Storage temperature range:

Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.

Maximum part temperature:

+155°C (ambient + temp rise).

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Core Material:

Composite

Weight:

0.36 – 0.49 g

Packaging:

500 per 7′′ reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 2.16 mm pocket depth.

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity).

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.

Refer to Soldering Coilcraft Components before soldering.