3D Model
Datasheet
Specifications
Electrical specifications at 25°C. Operating voltage 0 – 80 V
|
Part number 1 |
Inductance (µH)
2
(Tolerance: ±20%) |
DCR (mΩ) 3 | SRF (MHz) 4 | Isat (A) 5 | Irms (A) 6 | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| typ | max | min | typ | 10% drop | 20% drop | 30% drop | 20°C rise | 40°C rise | ||
| AE433PGA251MSZ | 0.25 | 2.5 | 3.0 | 104 | 130 | 7.5 | 12.0 | 16.5 | 13.5 | 18.0 |
Notes
- When ordering, please specify screening code: e.g. AE433PGA822MSZ.
- Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.
- DCR measured on a micro-ohmmeter.
- SRF measured using Agilent/HP 4395A or equivalent.
- DC current at 25°C that causes the specified inductance drop from its value without current. Click for temperature derating information.
- Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Click for temperature derating information.
Note:
Irms testing was performed on a 0.060” inch thick pcb with 4 oz copper traces optimized to minimize additional termperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Coilcraft CP-SA-10001 Group A
- G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
- 1 = EEE-INST-002 (Family 1) Level 1
- 2 = EEE-INST-002 (Family 1) Level 2
- 3 = EEE-INST-002 (Family 1) Level 3
- 4 = MIL-STD-981 (Family 04) Class B
- 5 = MIL-STD-981 (Family 04) Class S
- F = ESCC3201 (F4 operational life performed at 105°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Custom testing also available.
Environmental
Ambient temperature range:
–55°C to +105°C with (40°C rise) Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
L vs Current
General specification
Core Material:
Composite
Weight:
0.17 – 0.20 g
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.