Close up of ST251PHJ
Datasheet 3D Model

ST251PHJ Series

Shielded Power Inductor

ST251PHJ Series smallest power inductor – only 0.71 mm high, 1.14 x 0.635 mm footprint.
  • Handles current up to 2800 mAmps.
  • RoHS compliant matte tin over nickel over silverplatinum-glass frit. Other terminations available at addiitonal cost.

Looking for the commercial version of this part? See Coilcraft PFL1005 Series
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Specifications

. Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ±20%)
DCR (mΩ) 3 SRF min (MHz) 4 Isat (mA) 5 Irms (mA) 6
typ max 10% drop 20% drop 30% drop 20°C rise 40°C rise
ST251PHJ18NMRZ 18 45 55 2800 2000 2500 2600 1400 2000
ST251PHJ36NMRZ 36 40 50 2100 1500 2400 2800 1400 2000
ST251PHJ60NMRZ 60 50 60 1700 1300 1900 2100 1200 1600
ST251PHJ101MRZ 100 65 75 1800 1000 1500 1900 1100 1500
ST251PHJ181MRZ 180 110 125 1000 700 880 1100 900 1200
ST251PHJ271MRZ 270 205 230 750 450 650 740 700 910
ST251PHJ391MRZ 390 490 540 650 380 510 550 450 570
ST251PHJ561MRZ 560 490 540 520 300 440 490 410 530
ST251PHJ721MRZ 720 650 700 470 280 400 450 370 470
ST251PHJ102MRZ 1000 970 1030 390 270 350 380 310 400
Notes
  1. When ordering, please specify termination and screening codes: e.g. ST251PHJ102MRZ.
  2. Inductance tested at 7.9 MHz, 0.1 Vrms using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286 impedance analyzer.
  3. DCR measured on a micro-ohmmeter.
  4. SRF measured using an Agilent/HP 8753D network analyzer and a Coilcraft SMD-D test fixture.
  5. DC current at 25°C that causes the specified inductance drop from its value without current. Click for temperature derating information.
  6. Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.     Click for temperature derating information.

Termination:

  • R = Matte tin over nickel over silver-platinum glass frit.
  • P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit.
  • Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.

Screening:

  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Group A screening per Coilcraft CP-SA-10001
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
All screening performed to the document’s latest revision.
Custom screening also available.
Environmental
Ambient temperature range:
–40°C to +125°C.
Storage temperature range:
Component: –55°C to +140°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+140°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical L vs Current

Typical L vs Frequency

Physical characteristics

st251phjd.gif

Dimensions are in  inchesmm

Note: Dimensions are before optional solder applications. For maximum height dimension including solder, add 0.006 in / 0.152 mm.

General specification

Core Material:
Composite
Weight:
1.3 – 1.8 mg
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.