Datasheet
3D Model
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±10%) |
DCR max (mΩ) 3 | SRF typ (MHz) 4 | Isat (A) 5 | Irms (A) 6 | |||
|---|---|---|---|---|---|---|---|---|
| 10% drop | 20% drop | 30% drop | 20°C rise | 40°C rise | ||||
| ST413PHA272KLZ | 2.7 | 140.0 | 207 | 1.6 | 2.0 | 2.3 | 1.0 | 1.4 |
Notes
- When ordering, specify termination and screening codes: e.g. ST413PHA105KLZ.
- Inductance measured at 100 kHz, 0.1 Vrms, using Coilcraft SMD-A fixture in Agilent/HP 4263B impedance analyzer or equivalent.
- DCR measured on micro-ohmmeter and Coilcraft CCF858 test fixture.
- SRF measured using a Coilcraft CCF1297 test fixture and an Agilent/HP 8753D network analyzer or equivalent.
- DC current at 25°C that causes the specified inductance drop from its value without current.
- Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Termination:
- L = Silver-palladium-platinum-glass frit.
- T = Tin-silver-copper (95.5/4/0.5). (Special order, added cost)
- S = Tin-lead (63/37). (Special order, added cost)
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Group A screening per Coilcraft CPSA-10001
- G= Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
Environmental
Ambient temperature range:
–40°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +145°C.
Packaging: –55°C to +80°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+145°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
L vs Frequency
L vs Current
General specification
Core Material:
Ceramic/Ferrite
Weight:
116– 143 mg
Packaging:
750/7″ reel; 2500/13″ reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 3.3 mm pocket depth.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.