3D Model
Datasheet
Specifications
Electrical specifications at 25°C.
For Flyback Applications
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±20%) |
DCR max (Ω) 3 |
Isolation Voltage (V) |
Leakage Inductance (µH) 5 |
|---|---|---|---|---|
| AE412PJD184MPZ | 180 | 15.3 | 100 | 2.8 |
For SEPIC Applications
| Part number 1 |
Inductance (µH)
2
(Tolerance: ±20%) |
DCR max (Ω) 3 | SRF Typ (MHz) 4 | Coupling coefficient |
Leakage Inductance (µH) 5 |
Isat (mA) 6 | Irms (mA) | |||
|---|---|---|---|---|---|---|---|---|---|---|
| 10% drop | 20% drop | 30% drop | both windings 7 | one winding 8 | ||||||
| AE412PJD184MPZ | 180 | 15.3 | 7.5 | 0.99 | 2.8 | 150 | 160 | 170 | 100.00 | 140.00 |
Notes
- When ordering, please specify termination and screening codes: e.g. AE412PJD334MPZ.
- Inductance shown for each winding, measured at 100 kHz, 0.1 Vrms, 0 Adc on an Agilent/HP 4284A LCR meter or equivalent. When leads are connected in parallel, inductance is the same value. When leads are connected in series, inductance is four times the value.
- DCR is for each winding. When leads are connected in parallel, DCR is half the value. When leads are connected in series, DCR is twice the value.
- SRF measured using an Agilent/HP 4191A or equivalent. When leads are connected in parallel, SRF is the same value.
- Leakage Inductance is for L1 and is measured with L2 shorted.
- DC current at 25°C that causes the specified inductance drop from its value without current. It is the sum of the current flowing in both windings.
- Equal current when applied to each winding simultaneously that causes a 40°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
- Maximum current when applied to one winding that causes a 40°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
Termination:
- P = Tin-lead (63/37) over tin over nickel.
- R = Matte tin over nickel over silver-platinum glass frit.
- Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit.
Screening:
- Z = Unscreened
- Y = Unscreened (SLDC Option A)
- W = Unscreened (SLDC Option B)
- H = Coilcraft CP-SA-10001 Group A
- G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
- D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
- 1 = EEE-INST-002 (Family 1) Level 1
- 2 = EEE-INST-002 (Family 1) Level 2
- 3 = EEE-INST-002 (Family 1) Level 3
- 4 = MIL-STD-981 (Family 04) Class B
- 5 = MIL-STD-981 (Family 04) Class S
- F = ESCC3201 (F4 operational life performed at 105°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
- Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Packaging: –55°C to +80°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Current
Typical L vs Frequency
.gif "Typical L vs Frequency")
Schematics
General specification
Core Material:
Ferrite
Weight:
48 – 66 mg
Packaging:
1000/7′′ reel Plastic tape: 12 mm wide, 0.26 mm thick, 8 mm pocket spacing, 1.65 mm pocket depth.
Winding to Winding Isolation:
100 V
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
Recommended Pick & Place Nozzle:
OD: 3 mm; ID: ≤ 1.5 mm