Datasheet 3D Model
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Part number 1 Lines Common mode
peak impedance (kΩ)
frequency (MHz) 2
Common mode
attenuation typ (dB)
min (nH) 3
Irms (mA) 4 DCR max (Ω) 5 Isolation
Voltage (Vrms) 6
100 MHz 500 MHz 1 GHz
CP312FRA222MAZ 2 0.66 @ 1800 MHz 960 12.45 19.85 23.4 150 500 0.209 250
  1. When ordering, please specify termination and testing codes: e.g. CP312FRA222MAZ.
  2. Frequency at which the differential mode attenuation equals −3 dB.
  3. Inductance is measured on an Agilent 4286A (or equivalent) with a Coilcraft SMD-A test fixture using the listed correlation.
  4. Current per winding that causes a 20°C rise from 25°C ambient.
  5. DCR is measured on a Keithley 580 Micro-ohmmeter (or equivalent) with a Coilcraft CCF858 test fixture.
  6. Winding to winding isolation (hipot) tested for one minute.


  • A = Gold over nickel over silver-palladium-glass frit.
  • C = Tin-lead over gold over nickel over silver-palladiumglass frit. (Special order, added cost)
  • F = Tin-silver-copper over gold over nickel over silverpalladium-glass frit. (Special order, added cost)


  • Z = Unscreened
  • H = Group A screening per Coilcraft CP-SA-10001
All screening performed to the document’s latest revision.
Custom screening also available.
Ambient temperature range:
–40°C to +85°C with Irms current.
Storage temperature range:
Component: –55°C to +105°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+105°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Typical Attenuation (Ref: 50 Ohms)

Typical Impedance vs Frequency

Physical characteristics


General specification

Core Material:
4.9 – 5.2 mg
2000 per 7″reel; Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.14 mm pocket depth.


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.