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MS450RAA152

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Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (µH) 2 Tolerance (%) Q min
@ 50.0 MHz 3
SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
MS450RAA152_SZ 1.5 5,2 57 210 1.6 320
Notes
  1. When ordering, please specify tolerance and termination codes: e.g. MS450RAA333JSZ.
  2. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/ HP 4286 impedance analyzer or equivalent with Coilcraft-provided correlation pieces.
  3. Q measured at the same frequency as inductance using an Agilent/ HP 4291A with an Agilent/HP 16193 test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer or equivalent and a Coilcraft SMD-D test fixture.
  5. DCR measured on a micro-ohmmeter.

Tolerance:

  • G= 2%
  • J = 5%

Termination:

  • S = Tin-lead (63/37) over silver-platinum-glass frit.
  • T = Tin-silver-copper (95.5/4/0.5) over silver-platinumglass frit. (Special order, added cost)
  • P = Tin-lead (63/37) over tin over nickel over silver-platinum-glass frit. (Special order, added cost)
  • Q = Tin-silver-copper (95.5/4/0.5) over tin over nickel over silver-platinum-glass frit. (Special order, added cost)
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current
Storage temperature range:
Component: –55°C to +155°C
Tape and reel packaging: –55°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

Physical characteristics

ms450raa_dim.PNG

General specification

Core Material:
Ceramic
Weight:
102 – 142 mg
Packaging:
600 per 7″ reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 3.7 mm pocket depth.
Temperature coefficient of inductance:
+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.