Datasheet
3D Model
AE336RBA Series
Molded Chip Inductors
AE336RBA Series features exceptional Q values, even at high frequencies.
- Passes NASA low outgassing (Outgassing meets ASTM E595).
- Resistant to harsh chemical washes; excellent board adhesion.
- Fits standard 0805 footprint.
- Gold over nickel terminations. (Tin-lead (63/37) and tin-silver-copper are also available.)
Specifications
Electrical specifications at 25°C.
| Part number 1 |
Inductance (nH)
2
(Tolerance: ± 5%) |
Q min 3 | SRF min (MHz) 4 | DCR max (Ω) 5 | Imax (mA) 6 |
|---|---|---|---|---|---|
| AE336RBA3N0JAZ | 3.0 @ 250 MHz | 71 @ 1000 MHz | 5000 | 0.105 | 800 |
| AE336RBA050JAZ | 5.6 @ 250 MHz | 63 @ 1000 MHz | 4420 | 0.100 | 600 |
| AE336RBA110JAZ | 11 @ 250 MHz | 54 @ 500 MHz | 2975 | 0.144 | 600 |
| AE336RBA330JAZ | 33 @ 250 MHz | 57 @ 500 MHz | 1530 | 0.332 | 500 |
| AE336RBA121JAZ | 120 @ 150 MHz | 51 @ 250 MHz | 893 | 0.575 | 380 |
| AE336RBA151JAZ | 150 @ 100 MHz | 32 @ 100 MHz | 822 | 0.628 | 340 |
| AE336RBA231JAZ | 230 @ 100 MHz | 32 @ 100 MHz | 613 | 1.040 | 270 |
| AE336RBA321JAZ | 320 @ 100 MHz | 33 @ 100 MHz | 519 | 1.580 | 230 |
| AE336RBA471JAZ | 470 @ 50 MHz | 30 @ 100 MHz | 315 | 1.470 | 230 |
| AE336RBA681JAZ | 680 @ 25 MHz | 23 @ 50 MHz | 242 | 2.240 | 190 |
| AE336RBA102JAZ | 1000 @ 25 MHz | 22 @ 25 MHz | 220 | 3.000 | 150 |
| AE336RBA222JAZ | 2200 @ 25 MHz | 18 @ 25 MHz | 85 | 4.800 | 140 |
| AE336RBA332JAZ | 3300 @ 25 MHz | 22 @ 25 MHz | 110 | 8.070 | 80 |
Notes
- When ordering, please specify termination and screening codes: e.g. AE336RBA332JAZ.
- Inductance measured using a Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer with Coilcraft-provided correlation pieces.
- Q measured using an Agilent/HP 4291A with an Agilent/HP 16193 test fixture.
- SRF measured using an Agilent/HP 8720D network analyzer and a Coilcraft SMD -D test fixture.
- DCR measured on a Cambridge Technology micro-ohmmeter and a Coilcraft CCF858 test fixture.
- Current that causes a 15°C temperature rise from 25°C ambient.
Termination:
- A = Gold over nickel over moly-mag
- C = Tin-lead (63/37) over gold over nickel over moly-mag.
- F = Tin-silver-copper (95.5/4/0.5) over gold over nickel over moly-mag.
Screening:
- Z = Unscreened
- H = Coilcraft CP-SA-10001 Group A
- 1 = EEE-INST-002 (Family 3) Level 1
- 2 = EEE-INST-002 (Family 3) Level 2
- 3 = EEE-INST-002 (Family 3) Level 3
- 4 = MIL-STD-981 (Family 50) Class B
- 5 = MIL-STD-981 (Family 50) Class S
- F = ESCC3201 (F4 operational life performed at 90°C)
- Screening performed to the document’s latest revision.
- Lot qualification (Group B) available.
- Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
- Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Irms current, +125°C to +155°C with derated current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Tape and reel packaging: –55°C to +80°C.
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
Performance curves
Typical L vs Frequency
Typical Q vs Frequency
General specification
Core Material:
Ceramic
Weight:
18.0 – 23.0 mg
Packaging:
2000/7′′ reel; Plastic tape: 12 mm wide, 0.254 mm thick, 4 mm pocket spacing, 1.98 mm pocket depth.
Temperature coefficient of inductance:
+100 to +250 ppm/°C.
Soldering/Washing
Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Minimum five 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.