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Datasheet 3D Model

AE312RBA Series

Molded Chip Inductors

Our AE312RBA Series features exceptional Q and high SRFs, DCR and current carrying characteristics.
  • Outstanding self-resonant frequency.
  • Passes NASA low outgassing (Outgassing meets ASTM E595).
  • Fits standard 0603 footprint.
  • Gold over nickel terminations. (Tin-lead (63/37) and tin-silvercopper are also available.)

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Specifications

Electrical specifications at 25°C.

Part is not compliant with MIL-STD-981 Family 50, Class S due to wire gauge.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%) 		Q min 3 SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
AE312RBA2N2JAZ 2.2 @ 250 MHz 11.6 @ 250 MHz 5000 0.12 700
AE312RBA3N9JAZ 3.9 @ 250 MHz 16 @ 250 MHz 5000 0.096 700
AE312RBA6N8JAZ 6.8 @ 250 MHz 24.6 @ 250 MHz 5000 0.12 700
AE312RBA10NJAZ 10 @ 250 MHz 29 @ 250 MHz 5000 0.14 700
AE312RBA12NJAZ 12 @ 250 MHz 27 @ 250 MHz 3120 0.19 620
AE312RBA15NJAZ 15 @ 250 MHz 28 @ 250 MHz 2850 0.21 600
AE312RBA18NJAZ 18 @ 250 MHz 33 @ 250 MHz 2652 0.24 600
AE312RBA27NJAZ 27 @ 250 MHz 32 @ 250 MHz 2160 0.27 530
AE312RBA39NJAZ 39 @ 250 MHz 33 @ 250 MHz 2235 0.32 460
AE312RBA47NJAZ 47 @ 200 MHz 35 @ 200 MHz 2006 0.35 440
AE312RBA56NJAZ 56 @ 200 MHz 32 @ 200 MHz 1420 0.40 420
AE312RBA68NJAZ 68 @ 200 MHz 34 @ 200 MHz 1375 0.42 410
AE312RBA82NJAZ 82 @ 150 MHz 30 @ 150 MHz 1581 0.57 400
AE312RBAR12JAZ 120 @ 150 MHz 31.5 @ 150 MHz 1062 0.84 270
AE312RBAR15JAZ 150 @ 150 MHz 29 @ 150 MHz 1160 0.92 250
AE312RBAR20JAZ 200 @ 100 MHz 26 @ 100 MHz 1040 2.0 170
AE312RBAR22JAZ 220 @ 100 MHz 26 @ 100 MHz 1045 2.1 160
AE312RBAR27JAZ 270 @ 100 MHz 28 @ 100 MHz 867 2.2 150
AE312RBAR30JAZ 300 @ 100 MHz 23 @ 100 MHz 850 3.1 120
AE312RBAR39JAZ 390 @ 100 MHz 27 @ 100 MHz 748 4.1 100
Notes
  1. When ordering, specify termination and screening codes: e.g. AE312RBAR39JAZ.
  2. Inductance measured using a Coilcraft SMD-A test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
  3. Q measured at the same frequency as inductance using an Agilent/HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.

Termination:

  • A = Gold over nickel over moly-mag.
  • C = Tin-lead (63/37) over gold over nickel over moly-mag.
  • F = Tin-silver-copper (95.5/4/0.5) over gold over nickel over moly-mag.

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
  • Country of origin restrictions available; prefix options G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +155°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
See FIT/MTBF Calculations

Performance curves

Typical L vs Frequency

Typical L vs Frequency

Typical Q vs Frequency

Typical Q vs Frequency

Physical characteristics

ae312rba_dim.PNG

General specification

Core Material:
Ceramic
Weight:
3.5 – 8.0 mg
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +155 ppm/°C.

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.