AE235RBA Series

Molded Chip Inductors

AE235RBA Series features exceptional Q and high SRFs, DCR and current carrying characteristics.
  • Outstanding self-resonant frequency.
  • Passes NASA low outgassing (Outgassing meets ASTM E595).
  • Fits standard 0402 footprint.
  • Gold over nickel. (Tin-lead (63/37) and tin-silvercopper are also available.

Request Quote:
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Specifications

Electrical specifications at 25°C.

Part is not compliant with MIL-STD-981 Family 50, Class S due to wire gauge.

Part number 1 Inductance (nH) 2
(Tolerance: ± 5%)
Q min
@ 250 MHz 3
SRF min (MHz) 4 DCR max (Ω) 5 Imax (mA)
AE235RBA1N4JAZ 1.4 15 5000 0.090 600
AE235RBA2N2JAZ 2.2 15 5000 0.11 600
AE235RBA2N4JAZ 2.4 12 5000 0.12 600
AE235RBA3N8JAZ 3.8 15 5000 0.14 600
AE235RBA3N9JAZ 3.9 15 5000 0.14 600
AE235RBA5N6JAZ 5.6 18 5000 0.17 600
AE235RBA6N2JAZ 6.2 20 5000 0.17 600
AE235RBA6N8JAZ 6.8 20 5000 0.17 600
AE235RBA23NJAZ6 23 21 3450 0.35 400
AE235RBA40NJAZ6 40 21 2650 0.55 290
AE235RBA51NJAZ6 51 21 2250 1.1 100
AE235RBA56NJAZ6 56 22 1775 1.2 100
AE235RBA68NJAZ6 68 22 1700 1.4 100
AE235RBAR10JAZ6 100 21 1400 2.2 40
Notes
  1. When ordering, specify termination and screening codes: e.g. AE235RBAR39JAZ.
  2. Inductance measured at 250 MHz using a Coilcraft SMD-A test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286A impedance analyzer or equivalent.
  3. Q measured at the same frequency as inductance using an Agilent/ HP 4291A with an Agilent/HP 16197A test fixture or equivalents.
  4. SRF measured using an Agilent/HP 8753ES network analyzer and a Coilcraft CCF1232 test fixture.
  5. DCR measured on a Keithley 580 micro-ohmmeter and a Coilcraft CCF1010 test fixture.

Termination:

  • A = Gold over nickel over moly-mag
  • F = Tin-silver-copper (95.5/4/0.5) over gold over moly-mag
  • C = Tin-lead (63/37) over gold over nickel over moly-mag

Screening:

  • Z = Unscreened
  • H = Coilcraft CP-SA-10001 Group A
  • 1 = EEE-INST-002 (Family 3) Level 1
  • 2 = EEE-INST-002 (Family 3) Level 2
  • 3 = EEE-INST-002 (Family 3) Level 3
  • 4 = MIL-STD-981 (Family 50) Class B
  • 5 = MIL-STD-981 (Family 50) Class S
  • F = ESCC3201 (F4 operational life performed at 90°C)
  • Screening performed to the document’s latest revision.
  • Lot qualification (Group B) available.
  • Testing T and U have been replaced with more detailed codes 4, 5, and 1, 2, 3, respectively. Codes T and U can still be used, if necessary. Custom testing also available.
  • Country of origin restrictions available; prefix option G or F.
Environmental
Ambient temperature range:
–55°C to +125°C with Imax current.
Storage temperature range:
Component: –55°C to +155°C.
Packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Physical characteristics

ae235rba_dim.PNG
A max B max C max E ref F ref G ref H I J  
0.057 0.037 0.032 0.020 0.009 0.022 0.026 0.014 0.018 inches
1,45 0,94 0,81 0,51 0,23 0,56 0,66 0,36 0,46 mm

General specification

Core Material:
Ceramic
Weight:
TBD
Packaging:
2000 per 7″ reel Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing.
Temperature coefficient of inductance:
+25 to +155 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash.