3D Model Datasheet
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Part number 1 Common mode
peak impedance (kΩ)
frequency (MHz) 2
Inductance (µH) 3
(Tolerance: ±20%)
Irms (A) 4 DCR max (Ω) 5 Isolation
Voltage (Vrms) 6
MS412PJD473MSZ 48.7 @ 18 MHz 50.0 47 0.19 4.03 100
  1. When ordering, please specify screening code: e.g.MS412PJD334MSZ.
  2. Frequency at which the differential mode attenuation equals −3 dB.
  3. Inductance shown for each winding, measured at 100 kHz, 0.1 Vrms, 0 Adc on an Agilent/HP 4284A LCR meter or equivalent.
  4. Current that causes a 40°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
  5. DCR is for each winding.
  6. Interwinding isolation (hipot) tested for one minute.


  • S = Tin-lead (63/37) over tin over nickel.


  • Z = Unscreened
  • Y = Unscreened (SLDC Option A)
  • W = Unscreened (SLDC Option B)
  • H = Coilcraft CP-SA-10001 Group A
  • G = Coilcraft CP-SA-10001 Group A (SLDC Option A)
  • D = Coilcraft CP-SA-10001 Group A (SLDC Option B)
  • N = Group A screening per Coilcraft CP-SA-10004
    • Screening performed to the document’s latest revision.
    • Custom testing also available.
Ambient temperature range:
–55°C to +105°C with Irms current.
Storage temperature range:
Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C.
Maximum part temperature:
+155°C (ambient + temp rise).
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

Attenuation (Ref: 50 Ohms)

Impedance vs Frequency

Physical characteristics



General specification

Core Material:
48 – 66 mg
Winding to Winding Isolation:


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity).
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles.
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.